Forning and Processing Technology for Hard & Brittle Materials 2026/09/29

Introductions

As precision requirements for semiconductors and advanced optics intensify, the processing of hard and brittle materials has shifted from simple removal efficiency to managing form accuracy, surface figure, and residual stress. To overcome these challenges, we have developed three core technologies focused on wafer planarization and high-precision optical surface fabrication. These solutions provide precise processes for addressing critical bottlenecks across diverse application scenarios.

Technical Advantages and Features

• Wafer Planarization: Self-developed high-power (23 kW) grinding spindle with high axial stiffness (445 N/μm). Integrated ultrasonic vibration unit within the spindle effectively reduces cutting resistance and enhances processing stability. Equipped with an Acoustic Emission (AE) intelligent interpretation system for real-time monitoring of processing status.
• Atmospheric Micro-Plasma Beam Surface Figuring: Utilizes an atmospheric plasma micro beam with precise path control to achieve non-contact and low-stress surface figure correction. Applicable to small-scale (≤ 50 mm) glass and quartz for planar and geometric processing. Achieves surface figure accuracy up to 1/10 λ.
• Ultra-precision Ion Beam Surface Figuring: Applicable to a wide range of materials, including metals, ceramics, and optical glass. Capable of manufacturing planar, spherical and aspherical lenses with diameters from 50 to 600 mm. Achieves surface figure accuracy up to 1/20 λ.

Industrial Applications and Business Opportunities

• Industry Applications
  • Semiconductor wafers, critical semiconductor optical components, and aerospace/space-grade lenses.
• Application Examples
  • Collaborating with domestic grinding equipment makers, SiC wafer fabs, and optical suppliers, we provide processing solutions for hard and brittle materials.
  • Our technology is applied to SiC wafer grinding, achieving double productivity using 8000-grit grinding wheels.
  • It is also applied to high-end lens manufacturing, enhancing surface accuracy from 1/4 λ to 1/20 λ.