High-performance Computing Chip Water Immersion Cooling System 2026/09/29

Introductions

Conventional air-cooling and liquid-cooling technologies are insufficient to meet the thermal management requirements of single chips with heat loads up to 2,000 W. Liquid cooling systems also rely on coolant circulation and complex piping, increasing leakage risks and maintenance complexity while still resulting in high Power Usage Effectiveness (PUE). In data centers and high-performance computing environments, there is a strong need to ensure stable long-term operation while reducing PUE to lower energy consumption and operational costs.

Technical Advantages and Features

• Efficient Cooling with Microfluidics Technology: Water immersion cooling system utilizing efficient microfluidics technology. It delivers exceptional thermal conductivity of 50,000–100,000 W/m·K, far beyond the usual 500–10,000 W/m·K.
• Low PUE and Long-term Operation: Ultra-low power consumption of 12 W per micro pump, significantly lower than the typical 20–30 W, effectively reducing the PUE value of data centers and achieving a PUE close to 1.0.
• Eco-friendly Design and Pollution Reduction: Uses natural water for cooling, reducing costs and preventing equipment damage, while avoiding the environmental pollution associated with traditional fluorinated liquids.

Industrial Applications and Business Opportunities

• Industry Applications
  • Thermal management for high-performance computing chips including AI servers and HPC, liquid cooling technologies for data centers with high-density server racks, and thermal solutions for semiconductor equipment such as chip testing and advanced packaging.
• Application Examples
  • Partnered with leading semiconductor companies and data centers in Taiwan to implement this solution in kilowatt-level high-performance chip systems.
  • Through immersion cooling technology, overall PUE was reduced to 1.015, maintaining AI chip temperatures at a steady 30 °C during extended operation.
  • This enhances system performance, reduces energy costs, and supports low-carbon emissions.