Nano-metal Heat Dissipation Layers Technology 2026/09/29

Introductions

Traditional metal thermal materials tend to flow under gravity when applied in non-horizontal orientations, and common heat sink materials such as copper and aluminum struggle to conform to curved or irregular surfaces. This technology integrates graphene and liquid metal as a thermal interface material, ensuring strong adhesion. With thermal conductivity reaching up to 120 W/m·K, far exceeding the 10–50 W/m·K range of conventional materials, it significantly improves cooling performance for high-power applications while enhancing stability and product lifetime.

Technical Advantages and Features

• Non-directional Use: Thermal conductivity remains consistent in all directions and enables 360°/720° omni-directional heat conduction, adaptable to various shapes and structural designs.
• Ultra-high Thermal Conductivity: Enhances thermal conductivity through graphene and liquid metal, achieving a thermal conductivity coefficient of 100–120 W/m·K.
• Customizable Flexible Thermal Pads: Provides flexibility to thermal interface materials, minimizing chip damage and allowing application to the surfaces of various materials such as ceramics, polymers, and metals.

Industrial Applications and Business Opportunities

• Industry Applications
  • LED lighting, semiconductors, laser equipment, high-performance servers, AI computing, 5G communication devices, aerospace-grade applications, and general heat dissipation applications.
• Application Examples
  • Successfully applied to Taiwan’s leading semiconductor companies, AI computing industry pioneers, automotive motor manufacturers, and various LED lighting businesses.
  • Enhances heat dissipation efficiency and increases design flexibility across high-power thermal management applications.