Carbon Nanofluid Multi-loop Pulsating Heat Pipe 2026/09/29

Introductions

Traditional heat pipes require specific layouts based on heat source location, limiting their adaptability across different equipment. They also demand stricter operating conditions, including elevated evaporation temperatures and pressures. With thermal conductivity ranging from 10,000 to 15,000 W/m·K, they are insufficient for managing heat in high-power systems. This technology overcomes these limitations through a carbon nanofluid multi-loop pulsating heat pipe design for enhanced thermal performance.

Technical Advantages and Features

• Ultra-high Thermal Conductivity: Breaks through the limitations of traditional heat pipes, achieving thermal conductivity of up to 35,000 W/m·K.
• Initiates at Room Temperature: Operates at room temperature or at a low pressure of 10^-2 torr without requiring high-temperature evaporation.
• Requires Very Few Components: Utilizes multi-loop flow heat exchange technology to reduce power consumption from components such as pumps, effectively mitigating local overheating and heat backflow.

Industrial Applications and Business Opportunities

• Industry Applications
  • Thermal management for electronic devices such as 5G communication systems, servers, and power modules; high-power-density cooling applications including solar panels and battery management; and advanced energy management solutions for battery energy storage and smart energy systems.
• Application Examples
  • This solution is applied in the electronics and energy management industries across Taiwan, Japan, and other regions.
  • It addresses thermal challenges in high-power chips, enhancing system reliability and operational efficiency.