Plasma Process Key Modules and Equipment Technology 2026/09/29

Introductions

While plasma modules are the core components of semiconductor equipment, the market has mainly been dominated by major U.S. and Japanese suppliers. To overcome these industrial challenges, we focus on optimizing plasma density, uniformity, and stability in plasma deposition and etching processes. By resolving these critical technical bottlenecks, our technology significantly enhances process efficiency and production yields.

Technical Advantages and Features

• Critical Plasma Modules: Metal heating module achieves temperature uniformity ≥ 98% for 12-inch wafers at 300°C. Low-energy plasma torch delivers a Destruction and Removal Efficiency (DRE) of 85% for chemical substances (CF4).
• High-density Uniform ICP Source: Double-spiral induction coil design enhances plasma density and uniformity. Achieves 97% plasma source uniformity under low-pressure process environments (10 mT). Delivers a high plasma density of 4.4x10¹¹ cm^-3.
• High-aspect-ratio and Cross-flow ALD Equipment: Utilizes hybrid discrete pulse injection for precision control, meeting high-aspect-ratio deposition requirements for diverse alloys. Achieves 92% uniformity in step coverage film thickness.

Industrial Applications and Business Opportunities

• Industry Applications
  • Semiconductor, optoelectronics, and PCB industries.
• Application Examples
  • The initiative integrates upstream and downstream supply chains through collaboration with nearly 20 manufacturers, achieving over 70% localization of equipment and key modules while establishing a plasma industry cluster to enhance equipment autonomy.
  • Collaboration with leading end-users has led to the development of deposition (oxides/nitrides) and etching equipment for high-aspect-ratio (10:1+) vias.
  • By implementing cross-flow ALD and double-spiral ICP technologies, high-uniformity plasma systems have been delivered to help partners reduce development time and operating costs.