The Single-station Multifunctional Inspection System for Advanced Packaging 2026/09/29

Introductions

Traditional semiconductor packaging inspection relies on multiple stations, because a single station cannot perform multi-parameter inspection. We developed a common optical path design within a single field of view and a single station, integrating microscopy, interferometry, and confocal technologies to enable non-contact nano-resolution inspection, patterned critical dimension measurement, and multi-DoF measurements. It can be applied to advanced packaging stack alignment, patterned feature measurement, and warpage coplanarity inspection.

Technical Advantages and Features

• Single-station Hybrid Inspection: Integrates multiple inspection functions into a single station to eliminate transfer and realignment, reducing inspection time and equipment costs. Hybrid 2D microscopy and 3D interferometric/confocal inspection are achieved within the same field of view.
• Customized Inspection Equipment Development: Customized multi-functional optical modules and measurement recipes to meet process requirements. Built-in 2D/3D multi-parameter analysis engine with real-time parallel computing and visualized display.
• Multi-parameter Inspection: Inspection parameters include Critical Dimension (CD: 1.5 μm / OL: 0.2 μm), Topography and Coplanarity (Accuracy < 0.75%H), Roughness (Sa < 0.5 nm), Warpage and Thickness (Resolution 0.1 μm), 6-DoF Coordinates, Film/Glue Thickness, and Surface Defects (ISO 10110).

Industrial Applications and Business Opportunities

• Industry Applications
  • Advanced packaging, AI server read/write-head packaging, Mini/Micro LED packaging, panel-level packaging, and silicon photonics.
• Application Examples
  • Enables CD and overlay inspection for advanced packaging (CoWoS) and 5G filters.
  • Supports 6-DoF measurement for AI server HAMR processes.
  • Further supports glue underfill inspection for Mini/Micro LED, warpage and defect detection for panel-level packaging (PLP/CoPoS), and coplanarity inspection for silicon photonics probe arrays.