Wafer Handling Robot 2026/09/29

Introductions

Wafer robots previously faced challenges integrating into Equipment Front End Modules, including low space efficiency, large footprint, maintenance difficulties, limited stability, and electromagnetic interference affecting precision. With the growing demands of the semiconductor industry, the performance requirements for wafer transfer robots have also increased.

Technical Advantages and Features

• Embedded Design: Integrates electronic control components and the robot into a single unit, achieving high space utilization, easy maintenance, and elimination of electromagnetic interference.
• High-Speed and Low-Vibration Performance: Employs high-speed control technology capable of transferring 250 wafers per hour, while low-vibration control maintains vibration below 0.3 G.
• Vibration Monitoring Function: Uses an embedded vibrating fork sensor for effective vibration monitoring, while supporting flexible motion path planning and control.

Industrial Applications and Business Opportunities

• Industry Applications
  • Semiconductor, LED, and panel industries.
• Application Examples
  • This technology was transferred to a well-known Taiwanese automation equipment supplier to develop a high-speed, low-vibration wafer transfer robot with an embedded control system.
  • The system integrates electronic components and robots to improve space utilization, solves maintenance and electromagnetic interference issues in EFEM integration, and successfully boosts production capacity.