前往中央內容區塊 :::
:::
  1. 回首頁
  2. Research & Development
  3. Advanced And Green Process

Advanced And Green Process

2026-Plasma-Process-Key-Modules-and-Equipment-Technology.jpg 圖片
2026.09.29Advanced And Green Process

Plasma Process Key Modules and Equipment Technology

While plasma modules are the core components of semiconductor equipment, the market has mainly been dominated by major U.S. and Japanese suppliers. To overcome these industrial challenges, we focus on optimizing plasma density, uniformity, and stability in plasma deposition and etching processes. By resolving these critical technical bottlenecks, our technology significantly enhances process efficiency and production yields.
MORE
2026-Advanced-Electrode-Material-Design-for-Energy-Conversion.jpg 圖片
2026.09.29Advanced And Green Process

Advanced Electrode Material Design for Energy Conversion

To overcome the scarcity and high cost of precious metals (e.g., Pt, Ir) in hydrogen applications, this technology establishes an "Advanced Energy Conversion Electrode Material Development Platform." By utilizing multi-element design and high-throughput electrocatalyst screening, we develop promising new materials that provide low-cost, high-performance electrode solutions for fuel cells and hydrogen electrolysis.
MORE
2026-High-performance-Computing-Chip-Water-Immersion-.jpg 圖片
2026.09.29Advanced And Green Process

High-performance Computing Chip Water Immersion Cooling System

Conventional air-cooling and liquid-cooling technologies are insufficient to meet the thermal management requirements of single chips with heat loads up to 2,000 W. Liquid cooling systems also rely on coolant circulation and complex piping, increasing leakage risks and maintenance complexity, while still resulting in high Power Usage Effectiveness (PUE). In data centers and high-performance computing environments, there is a strong need to ensure stable long-term operation while reducing PUE to lower energy consumption and operational costs.
MORE
2026-Precision-Elastic-Product-Collaborative-Fabrication-.jpg 圖片
2026.09.29Advanced And Green Process

Precision Elastic Product Collaborative Fabrication Design Technology

Precision elastic materials, such as springs and seals, possess high precision and elasticity. Extensively used in the rubber, plastics, and textile industries, the elasticity complicates precise automated control, potentially affecting product quality. This technology enables the development of collaborative automated processes for elastic materials.
MORE
2026-High-efficiency-Powertrain-Rotating-Machinery.jpg 圖片
2026.09.29Advanced And Green Process

High-efficiency Powertrain & Rotating Machinery Design Technology

Rotating machinery such as motors, engines, compressors, fans, and pumps are widely used in vehicles, manufacturing equipment, and energy systems. Their performance and lifespan directly impact energy consumption, costs, and industrial competitiveness. To address trends in energy efficiency and smart technologies, this solution integrates AI optimization, multi-physics coupling simulation, and system dynamics analysis to develop high-efficiency power system technologies.
MORE
2026-The-Single-station-Multifunctional-Inspection-System-.jpg 圖片
2026.09.29Advanced And Green Process

The Single-station Multifunctional Inspection System for Advanced Packaging

Traditional semiconductor packaging inspection relies on multiple stations, due to a single station cannot perform multi-parameter inspection. We developed a common optical path design within a single field-of-view and a single station, which integrating Microscopy, Interferometry, and Confocal enables multi-functions of non-contact nano-resolution, patterned critical dimension and multi-DoF measurements. It can be applied to measurements of advanced packaging stack alignment, patterned features and warpage coplanarity.
MORE
2026-Forning-and-Processing-Technology-for-Hard-Brittle-Materials.jpg 圖片
2026.09.29Advanced And Green Process

Forning and Processing Technology for Hard & Brittle Materials

As precision requirements for semiconductors and advanced optics intensify, the processing of hard and brittle materials has shifted from simple removal efficiency to managing form accuracy, surface figure, and residual stress. To overcome these challenges, we have developed three core technologies focused on wafer planarization and high-precision optical surface fabrication. These solutions provide precise processes for addressing critical bottlenecks across diverse application scenarios.
MORE
TOP