簡介 Introductions
透過組裝公差演算分析優化模型，結合產線檢測作業之尺寸資訊擷取，計算並提供最佳品質組裝指南，解決傳統組裝作業常遭遇組裝尺寸不合，只能換取工件再組裝或現場手工修調之問題。可降低組裝重工時間，同時提升產品組裝品質一致性
The module provide the assembly guide via capturing the dimensional information from production line and calculating the best assembly quality through optimization algorithm, , and reduces the repair/rework problems encountered at the traditional assembly operation. The module can reduce assembly rework time and improve consistency of assembly quality.
特色與創新 Characters and Innovations
- 提供組裝配適建議，降低修配/重工機率。
- 提升組裝品質一致性 。
- 提高製造公差外廢品利用率 。
- 支援藍芽（無線）量測資訊傳輸，並可整合自動量測模組（接觸/非接觸） 。
- Provide suggestions for assembly and reduce the probability of repair/rework.
- Improve assembly quality and consistency.
- Increase the utilization rate of workpieces beyond manufacturing tolerances.
- Supports Bluetooth measurement data transmission, and can easily integrate automatic contact or non-contact measurement modules.