產業脈動｜全球半導體產業藍圖：先進製造技術爭霸與全 球擴產布局

全球半導體市場正由周期性波動邁向結構性成長轉移。受惠於生成式AI 與高效能運算基礎建設的 強勁需求，全球半導體營收將於2026 年突破兆美元大關。此波成長的核心驅動機制在於單一晶片架構複 雜化所帶來的晶片產值顯著提升。在先進製程技術方面，隨著傳統 FinFET 電晶體架構逼近物理極限，未 來市占重組的決勝點轉向2 奈米及以下的技術驗證與生態系建構。台積電、三星、英特爾三大巨頭正圍 繞全環繞閘極電晶體與晶背供電等技術展開競逐。同時，地緣政治重塑供應鏈，各廠加速海內外產能多 元配置，在確保技術領先的同時，積極打造跨區域的全球供應鏈韌性。

The global semiconductor market is shifting from cyclical volatility toward structural growth. Driven by strong demand for generative AI and high-performance computing infrastructure, global semiconductor revenue is expected to surpass the trillion-dollar threshold in 2026. The core driver of this growth lies in the significant increase in chip value resulting from increasingly complex single-chip architectures. In advanced process technology, as the conventional FinFET transistor architecture approaches its physical limits, the decisive factor in future market share reshuffling is shifting toward technology qualification and ecosystem development at 2 nm and below. TSMC, Samsung, and Intel are competing around technologies such as gate-all-around transistors and backside power delivery. At the same time, geopolitics is reshaping supply chains, prompting manufacturers to accelerate diversified capacity deployment across domestic and overseas sites. While maintaining technology leadership, they are also actively building cross-regional global supply chain resilience.