雷射超精密微奈米結構加工技術介紹

雷射加工技術廣泛應用於結構製造中，包括鑽孔、切割與退火，不但突破傳統刀具式的接觸破壞影響，還能消除殘留應力與接觸角度的問題。然而利用能量束雖然可直接加工任何材料，但其加工之結構大小仍無法突破聚焦尺度限制，再者，經由熱加工機制容易使材料受熱擴散影響，而造成精度不足與表面形貌改變。現階段超快雷射系統已發展完善，特色是利用其非線性光子吸收機制，將有效打斷材料間之化學鍵結，直接以離子化做為加工機制，突破傳統雷射加工技術在熱影響之限制，更能於聚焦點之內進行加工，因而達到奈米等級之加工尺寸。超快雷射加工製造技術不僅能製作平面二維結構，更能搭配特殊加工製程，於透明材料內製作複雜的三維結構，成為可廣泛應用於半導體、生醫、光電與能源等不同領域之微奈米元件、裝置和產品的製造技術。

The laser machining technology for structure fabrication applications include drilling, cutting and annealing that are different from CNC machining due to non-contact effect for the materials. The laser machining is used to solve the problems of residual stress and contact angle treatment. At the same time, its energy beam can be directly used in any materials. However, the limitation of fabricated structures still need to be overcome some problems such as the spot size and heat effect in the fabricated process. Recently, the pulse duration of ultra-fast laser is developed that the behavior of non-linear photon absorption is effective in cutting the chemical bond between the material and the other material. The heat affected zone on material surface can be ignored for this directly ionized machining. And then, the fabricated structures can be reduced the scale size within the laser spot size. With this technique, the repeatable structures between the microscaled to the nanoscaled sizes are successfully fabricated. The ultra-fast laser machining provides wide-range and exciting new possibilities in fabricated 2-dimensional and 3-dimensional micro/ nanostructures for semiconductor, biotechnology, medicine, electronics, optics and energy industries.