全球半導體設備產業格局：2024現況與2025趨勢

2024 年全球半導體市場規模達 6,559 億美元，年成長達 21%，主因記憶體價格回升與 AI 晶片需求強勁。設備市場的全球出貨值達 1,171 億美元，年成長為 10%，以先進製程與封裝擴產為主要驅動力。AI 與 HPC 晶片帶動 EUV、ALD、蝕刻等設備需求快速上升；先進封裝如CoWoS與 Fan-Out 則推動鍍膜、雷射加工與量測設備需求同步成長。主要設備供應商持續集中，前五大廠商市占率達 71%。展望 2025 年，預計將有 18 座晶圓廠動工，設備市場將持續聚焦於先進節點與高階製程應用，推動產業進一步升級與轉型。

In 2024, the global semiconductor market reached USD 655.9 billion, marking a 21% annual growth driven primarily by the rebound in memory prices and strong demand for AI chips. The global semiconductor equipment market recorded USD 117.1 billion in shipments, with a 10% year-over-year increase fueled by capacity expansion in advanced processes and packaging technologies. Demand for equipment such as EUV, ALD, and etching surged due to AI and HPC chip production, while advanced packaging technologies like CoWoS and Fan-Out drove corresponding growth in coating, laser processing, and metrology equipment. Market concentration among major equipment suppliers remained high, with the top five companies holding a combined market share of 71%. Looking ahead to 2025, construction is expected to begin on 18 new fabs, and the equipment market will continue to focus on advanced nodes and high-end process applications, further advancing industry upgrades and transformation.