先進封裝技術與異質整合發展趨勢分析：以TSV、TGV為例

隨著摩爾定律逐漸放緩，異質整合已成為提升系統效能與功能密度的關鍵技術。先進封裝技術不僅是晶片尺寸縮小的延伸，更是異質系統整合的核心支撐。本文探討了二種具代表性的先進封裝技術：穿矽通孔 (Through Silicon Via ,TSV)以及玻璃穿孔 (Through Glass Via ,TGV)，分析其技術原理、優缺點與應用場景，並比較其在成本、效能與可擴展性上的異同。此外，文章特別針對玻璃穿孔 (Through Glass Via ,TGV) 製程挑戰進行深入分析，並介紹工研院開發之創新濕式製程，有效解決物理氣相沉積 (Physical vapor deposition，PVD) 於高深寬比孔洞中附著與填充不良問題，為未來異質整合封裝提供具備實用性與可量產潛力的解決方案。

As Moore’s Law continues to slow, heterogeneous integration has emerged as a critical technology for enhancing system performance and functional density. Advanced packaging technologies are no longer merely an extension of chip miniaturization, but rather a foundational enabler of heterogeneous system integration. This article explores two representative advanced packaging technologies: Through-Silicon Via (TSV) and Through-Glass Via (TGV), analyzing their technical principles, advantages and limitations, and application scenarios. It also compares their differences in terms of cost, performance, and scalability. In particular, the study delves into the manufacturing challenges of TGV and introduces an innovative wet-process solution developed by ITRI, which effectively addresses adhesion and filling issues encountered with PVD in high aspect ratio vias. This advancement offers a practical and scalable solution for future heterogeneous integration packaging.