TGV高深寬比封裝全濕式製程整合方案 2025/10/16

隨著 2.5D/3D 異質整合與大尺寸面板封裝的推進，基板因熱膨脹不匹配而容易產生翹曲，導致良率與可靠度下降。TGV 玻璃基板兼具低熱膨脹、高頻穩定與面板級可擴展性，高深寬比填孔技術可實現高密度晶片堆疊與微細線路製作。

With the advancement of 2.5D/3D heterogeneous integration and large-panel packaging, substrate warpage caused by thermal expansion mismatch has become a critical challenge, reducing both yield and reliability. TGV glass substrates, featuring low thermal expansion, high-frequency stability, and scalability to panel-level formats, enable high-aspect-ratio via filling for dense chip stacking and fine-pitch interconnect fabrication.

技術特色

高深寬比（AR≧15）、高附著力TGV濕式封裝整合技術，成功實現面板級封裝製程

High-aspect-ratio (AR ≥ 15) and high-adhesion TGV wet-packaging integration technology successfully implemented in panel-level packaging processes.

解決方案

開發附著層鍍層，可有效提升金屬銅層與玻璃之間的附著性（≧ 6 N/cm），電鍍填孔技術適用不同孔型(直孔、X孔、漏斗孔)，達AR>≧15，均勻度~90%，良率>95%，電鍍缺陷<5%。

The developed adhesion layer significantly enhances the bonding strength between copper and glass (≥ 6 N/cm). The electroplating via-filling process supports various via structures (straight, X-shaped, and funnel types), achieving AR ≥ 15, ~90% uniformity, >95% yield, and <5% plating defects.

應用案例

可應用產業：PCB產業、先進半導體封裝產業、顯示設備產業

Applications: PCB industry, advanced semiconductor packaging, and display technology.