光電與半導體製程之含氟溫室氣體替代與減碳 技術

在隨著全球淨零排放趨勢及光電與半導體先進製程持續發展，含氟溫室氣體排放管理已成為光電 與半導體產業重要的減碳課題。CF₄、C₂F₆、NF₃ 及SF₆ 等製程氣體廣泛應用於乾式蝕刻與腔體清洗製程， 其全球暖化潛勢遠高於二氧化碳，因此如何降低其使用與排放已受到高度關注。本文介紹目前含氟溫室 氣體減量技術發展現況，並說明工研院機械所相關研發成果。期望透過持續的技術創新與製程優化，協 助半導體產業降低含氟溫室氣體的排放，朝向低碳製造與永續發展目標邁進。

Driven by the global trend toward net-zero emissions and the continuous advancement of semiconductor and optoelectronic technologies, the management of fluorinated greenhouse gas emissions has become a critical decarbonization challenge for the industry. Process gases such as CF4, C2F6, NF3, and SF6 are widely used in dry etching and chamber cleaning processes. However, their global warming potentials are significantly higher than that of CO2, making the reduction of their usage and emissions an increasingly important issue. This article reviews the current development of fluorinated greenhouse gases mitigation technologies and presents related research achievements of our team. Through continuous technological innovation and process optimization, these efforts aim to support the semiconductor industry in reducing fluorinated greenhouse gases emissions and advancing toward low-carbon manufacturing and sustainable development.