壓力感測器於半導體設備之應用

半導體製程與電子組裝設備中，接觸介面壓力分布均勻性常直接影響產品良率與設備可靠度。本文 介紹以壓阻式原理 (piezoresistive) 及採用網版印刷 (screen printing) 技術製作之觸覺壓力感測器。透過金屬 網目布局設計，可製作小至大面積感測器，因應不同設備應用需求。本文以PCB 夾持設備廠商之夾爪取 放印刷電路板 (PCB) 之案例，展示感測器於量測夾持壓力均勻性、降低基板損傷之成效，透過圖形化使 用者介面 (GUI) 呈現訊號變化。此外，本文亦針對化學機械研磨 (Chemical-Mechanical Polishing, CMP) 設 備之壓力量測進行探討，說明大面積感測器布局設計與量測能力可作未來延伸應用之基礎，並指出實際 導入須克服之技術挑戰。

In semiconductor manufacturing and electronic assembly equipment, the uniformity of contact pressure distribution at working interfaces directly affects product yield and equipment reliability. This article introduces a tactile pressure sensor based on the piezoresistive principle, fabricated using screen printing technology. Through metal mesh layout design, both small-area and large-area sensors can be produced to meet different equipment application needs. This article uses a real case of a gripper from Chanyi Industrial Co. Ltd. picking up printed circuit boards (PCB) as validation, demonstrating the sensor’s effectiveness in measuring grip pressure uniformity and reducing substrate damage risk, with signal changes presented through a real-time graphical user interface (GUI). In addition, this article discusses the pressure measurement needs of chemical-mechanical polishing (CMP) equipment, explaining how the layout design and measurement capability of the large-area sensor can serve as a foundation for future extended applications, while identifying the technical challenges that must be addressed before actual implementation.