簡介 Introductions
PCBECI–OPC UA 伺服模組可解決電子設備/半導體製程冗長複雜,掌握製造進度與生產變異,現今透過專屬通訊和機台溝通,技術門檻高;PCBECI–OPC UA聯網及通訊伺服模組可輔助業者進行AI決策分析,多重感測器佈建,使生產數據與製造資料間之數據整合與時序同步。
The PCBECI–OPC UA servo can solve the complex process of electronic/semiconductor equipment, grasp the manufacturing progress and production variation, and communicate with machines through dedicated protocols with high technology thresholds. The PCBECI–OPC UA module can assist the industry to carry out AI decision-making analysis, deploying multiple sensors, and enabling data integration and timing synchronization between production and manufacturing.
特色與創新 Characters and Innovations
- 依據SEMI規範,內建資訊模型,符合產業生產特性。
- 整合生產與感測時序資料,滿足關鍵問題分析需求。
- 具備PCBECI/SECSGEM標準通訊,提供完整E5、E30訊息交握方法,可兼容現場各種通訊能力機台。
- Built-in information model conforms to the characteristics of industrial production according to SEMI standards.
- Integrate the time series data of production and sensing to meet the analysis needs of key issues in real-time.
- Follows PCBECI/ SECSGEM standards, provides complete E5 and E30 message handshake methods, compatible with various communication capabilities on site.