顯微干涉同步檢測模組 2025/10/14

半導體層疊封裝結構日趨複雜，多參數的精密檢測變得更加挑戰，需求多參數複合式檢測系統

As semiconductor layered packaging become increasingly complex, precision multi-parameter inspection becomes more challenging. Multi-parameter hybrid inspection system is needed.

技術特色

以顯微干涉同步檢測模組，建立多參數複合式檢測系統，將2D顯微及3D干涉兩技術做共光路整合，有節省成本、減少傳輸量測時間、即時共視野量測、多參數檢測分析等優點，且具備one frame 3D干涉量測特性

The multi-parameter hybrid inspection system is established using Simultaneous Detection Module of Microscopy and Interferometry integrates 2D microscopy and 3D interferometry techniques into a common optical path, offering advantages such as cost savings, reduced transmission and measurement time, real-time common-field-of-view measurement, and multi-parameter inspection analysis. It also features one-frame 3D interferometry.

解決方案

利基應用於先進封裝CD/OL量測、Hybrid Bonding及Patterned Wafer量測等。

Niche applications in advanced packaging CD/OL measurement, hybrid bonding, and patterned wafer measurement.