簡介 Introductions
本技術整合2D與3D量測於單站，減少50%檢測時間並降低40%設備成本，適用先進封裝之多參數檢測。
The common optical path design of microscopy and interferometry provides 2D/3D real-time analysis capabilities in the same field of view and can be applied to two-in-one single-station Critical Dimension/Overlay inspection.
特色與創新 Characters and Innovations
- 一站式完整解決方案，提供單站2D顯微/3D干渉的多參數檢測模式。
- 可共視野檢测晶團及元件的關鍵尺寸、缺陷、高度及粗度參數。